DSAUD003597.pdf by National Semiconductor

Partial File Text The SO (small outline) package has been developed to meet customer demand for ever-increasing miniaturization and component density. COMPONENT SIZE COMPARISON S.O. Package AN008766-1 AN00876
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAUD003597.pdf preview

Download Datasheet

User Tagged Keywords