DSA0061108.pdf

Partial File Text NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA0061108.pdf preview

Download Datasheet

User Tagged Keywords

35 x 35 PBGA, 580 100 balls BGA Ball Crack BGA PACKAGE thermal resistance of BGA Staggered pins of BGA Staggered Pins package without underfill