DSA0042474.pdf by Analog Devices

Partial File Text Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for p
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2-CQFP BGA 144 BGA-64 pad CQFP 240 exposed QFP 128 exposed QFP 144 G38-87 G42-88 LQFP-48 thermal pad LQFP-64 thermal pad QFP-128 20 x 14 pad SOT23 JEDEC standard TSSOP 16 jc

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