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    DSAZSAA00019981.pdf by NXP Semiconductors

    • Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm A B D SOT893-1 ball A1 index area A E A2 A 1 detail X
    • Original
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    DSAZSAA00019981.pdf preview

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