DSAZSAA00019924.pdf by NXP Semiconductors

Partial File Text Package outline HTQFP64: plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad SOT855-4 c y exposed die pad X Dh A 48 33 49 Z
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAZSAA00019924.pdf preview Download Datasheet