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    DSAZSAA00019893.pdf by NXP Semiconductors

    • Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A
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    DSAZSAA00019893.pdf preview

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