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    DSAZSAA00019891.pdf

    • NXP Semiconductors
    • Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-3 terminal 1 index area E A A1 c
    • Original

    DSAZSAA00019891.pdf preview Download Datasheet

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