DSAZSAA00019882.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm A B D SOT804-3 terminal 1 index area E A A1 c d
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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