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    DSAZSAA00019881.pdf by NXP Semiconductors

    • Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-2 B D D1 A terminal 1 index area A A4 E1
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    DSAZSAA00019881.pdf preview

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