DSAZSAA00019880.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1 A terminal 1 index area A A4 E1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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