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    DSAZSAA00019818.pdf by NXP Semiconductors

    • Package outline TFBGA228: plastic thin fine-pitch ball grid array package; 228 balls; body 12 x 12 x 0.8 mm A B D SOT655-1 ball A1 index area A A2 E A1 detail X C e1
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    DSAZSAA00019818.pdf preview

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