DSAZSAA00019803.pdf by NXP Semiconductors

Partial File Text Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D1 ball A1 index area A j A2 A1 E1 E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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