DSAZSAA00019734.pdf by NXP Semiconductors
- Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X
- Original
- Unknown
- Unknown
- Unknown
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