DSAZSAA00019733.pdf by NXP Semiconductors

Partial File Text Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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