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    DSAZSAA00019732.pdf by NXP Semiconductors

    • Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1
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    DSAZSAA00019732.pdf preview

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