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    DSAZSAA00019717.pdf

    • NXP Semiconductors
    • Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-7 terminal 1 index area E A A1 c
    • Original

    DSAZSAA00019717.pdf preview Download Datasheet

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