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    DSAZSAA00019702.pdf by NXP Semiconductors

    • Package outline seating plane SDIP64: plastic shrink dual in-line package; 64 leads (750 mil) SOT274-1 ME D A2 A L A1 c e Z b1 (e 1) w M MH b 33 64 p
    • Original
    • Unknown
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    DSAZSAA00019702.pdf preview

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