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    DSAZSAA00019645.pdf by NXP Semiconductors

    • Package outline SOT1354-1 XFBGA16: plastic, extremely thin fine-pitch ball grid array package; 16 balls A B D ball A1 index area A2 A E A1 detail X e1 C e C A
    • Original
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    DSAZSAA00019645.pdf preview

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