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DSAZSAA00019632.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm D B SOT1335-1 A A Terminal 1 index area E A1 det
Datasheet Type
Original
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