DSAZSAA00019105.pdf by NXP Semiconductors
- Package outline HBGA420: plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink A B D SOT603-1 ball A1 index area A A2 A1 E A4 detail
- Original
- Unknown
- Unknown
- Unknown
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