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    DSAZSAA00019052.pdf by NXP Semiconductors

    • Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT519-1 A X c y HE v M A Z 9 16 A2 A (A 3)
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    DSAZSAA00019052.pdf preview

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