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DSAFRAZ0016357.pdf
by Philips Semiconductors
Partial File Text
PDF: 2002 Aug 09 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1
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jedec MO 225
VFBGA56