DSAZSAA00018982.pdf by NXP Semiconductors

Partial File Text Package outline HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z b 10 18 c w M b1 (e 1) b2
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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