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    DSAZSAA00018924.pdf by NXP Semiconductors

    • Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1 X A B D E A A1 A3 termin
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    DSAZSAA00018924.pdf preview

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