DSAZSAA00018841.pdf by NXP Semiconductors

Partial File Text Package outline BGA240: plastic ball grid array package; 240 balls; body 23 x 23 x 1.55 mm SOT711-2 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b e
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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