DSAZSAA00018834.pdf by NXP Semiconductors
- Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C
- Original
- Unknown
- Unknown
- Unknown
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