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    DSAZSAA00018780.pdf

    • NXP Semiconductors
    • Package outline LFBGA136: plastic low profile fine-pitch ball grid array package; 136 balls B D SOT1058-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b
    • Original

    DSAZSAA00018780.pdf preview Download Datasheet

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