DSAZSAA00018779.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN38R: plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm B D SOT1056-1 A terminal 1 index area E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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