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    DSAZSAA00018776.pdf

    • NXP Semiconductors
    • Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm X b v M A B B D SOT1052-1 A A E
    • Original
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    DSAZSAA00018776.pdf preview Download Datasheet

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