DSAZSAA00018776.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm X b v M A B B D SOT1052-1 A A E
Datasheet Type Original

DSAZSAA00018776.pdf preview Download Datasheet