DSASW00313709.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-28, 300 mils, Extended Footprint CASE 751BN-01 ISSUE A DATE 17 MAR 2009 SYMBOL MIN NOM MAX A 2.65 0.10 0.30 A2 2.
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751BN-01 DIMENSIONS soic 28 footprint soic28 SOIC-28 SOIC28 SOIC28-049-01

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