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    DSASW00313706.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-24, 300 mils CASE 751BK-01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN A NOM 2.35 MAX 2.65 A1 0.10 0.30 A2 2.05 2.
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