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    DSASW00313704.pdf

    • ON Semiconductor
    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-16, 300 mils CASE 751BH-01 ISSUE A DATE 18 MAR 2009 D SYMBOL MIN NOM MAX 2.49 2.64 A 2.36 A1 0.10 b 0.33
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