DSASW00313700.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD-01 ISSUE O DATE 19 DEC 2008 SYMBOL A 1.75 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80
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