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    DSASW00313564.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 2x2, 0.65P CASE 517BG-01 ISSUE A DATE 04 FEB 2010 SCALE 4:1 0.10 C 0.10 C EXPOSED Cu PLATING E ÍÍ ÍÍ ÍÍ PIN ONE REFER
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