DSAZSAA00017868.pdf by NXP Semiconductors
- Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c
- Original
- Unknown
- Unknown
- Unknown
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