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    DSASW00313439.pdf by ON Semiconductor

    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN16, 1.8x2.6, 0.4P CASE 488AP-01 ISSUE B DATE 25 JUN 2008 1 SCALE 5:1 DETAIL A E EXPOSED Cu 0.15 C B ALTERNATE CONSTRUCTIONS
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