Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAZSAA00017570.pdf by NXP Semiconductors

    • SOT172D CRDB4; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 18 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bot
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Powered by Findchips

    DSAZSAA00017570.pdf preview

    Supplyframe Tracking Pixel