DSAZSAA00017556.pdf by NXP Semiconductors

Partial File Text SOT119A CDFM6; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 â 1 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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