DSAZSAA00017487.pdf by NXP Semiconductors
- Bare die outline Bare die; 99 bumps; 5.28 x 1.4 x 0.38 mm PCA8533-2 X D 85 30 y PC8533-2 E x 0,0 99 1 29 Y b A e1 e A1 L detail X detail Y
- Original
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