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    DSAZSAA00016849.pdf by NXP Semiconductors

    • Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w
    • Original
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    DSAZSAA00016849.pdf preview

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