DSA0054620.pdf by Analog Devices
- Materials Declaration Package Body Size LeadCount Option PDIP 300 mils 24 Sn/Pb Molding Compound % of Compound Weight (g) 16 2.05 E-01 72 9.23 E-01 8 1.03 E-01 2.2 2.82 E-02 1.
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
