Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0089037.pdf

    • -
    • Thermal Data SO28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( si
    • Original

    DSA0089037.pdf preview Download Datasheet

    User Tagged Keywords

    SO-28-2
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel