DSAFRAZ0012223.pdf by Linear Technology

Partial File Text Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModuleTM solu
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IPC-7525 IPC-7527 IPC7525 for lga koki solder paste LGA 32 land pattern LGA land pattern LGA voiding LTM46 LTM4600 reflow profile FOR LGA COMPONENTS Solder Paste, Indium 5.1 AT

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