ScansEX71669.pdf
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(NOTES)1. TAB PU
ng strength : Ouer 9. BN(1. Okg-f) 9. BN(1. Bkgf)
CD
-H
'C
1. B
±D. 1
(Side Solder
Plating fìrea) (fJJM/W W)
2.1
±0.4
T r+D.3 ^-0. 5
CD +1
1.8
±G. 5
(Solder Plating fìrea) ^^ (IW
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