Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA2IH00138076.pdf

    • Not Available
    • Philips Semiconductors Short-form objective specification GSM signal processing 1C FEATURES · Fabricated in a 0.5 nm/0.4 urn C M O S process with 3-layer metal · L Q F P 1 28 package · 3.3 V o
    • Scan

    DSA2IH00138076.pdf preview Download Datasheet

    User Tagged Keywords

    CLK20M OF IC 741 schmitt trigger
    Supplyframe Tracking Pixel