DSAFRAZ0010966.pdf

Manufacturer Intel
Partial File Text Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing pow
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240817 64 ceramic quad flatpack a5600 A5603-01 CDIPS CERAMIC CHIP CARRIER LCC 68 socket CERAMIC LEADLESS CHIP CARRIER LCC 32 socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC PIN GRID ARRAY CPGA lead frame dimensions CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE intel packaging lccs 28 footprint LCCs 68 socket PCB footprint cqfp 132 QFP 64 Cavity package