DSASW00296630.pdf

Partial File Text Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy Qiang Xiao*, Luu Nguyen**, William D. Armstrong* * Department of Mechanical Engineering, University of Wyoming, Laramie, WY 82071 ** National S
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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63Sn37Pb 63Sn37Pn Cu6Sn5 study of alloy

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