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DSASW00296627.pdf
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Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
Cu3Sn
Cu6Sn5
Cu6Sn5 formation
DE-AC03-76SF00098
Ortec
sncu0.7
whisker Cu base
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