DSAISS0006721.pdf by Central Semiconductor
- PROCESS CPZ28 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 13 MILS Die Thickness 7.8 MILS Anode Bonding Pad Area 7.0 x 7
- Original
- Unknown
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